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HM7065 Datasheet(PDF) 4 Page - Shenzhen Huazhimei Semiconductor Co., Ltd

Part # HM7065
Description  5A, 500KHz Synchronous Boost Converter with Output Disconnect
PDF  7 Pages
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Manufacturer  HMSEMI [Shenzhen Huazhimei Semiconductor Co., Ltd]
Direct Link  http://www.hmsemi.com/
Logo HMSEMI - Shenzhen Huazhimei Semiconductor Co., Ltd

HM7065 Datasheet(HTML) 4 Page - Shenzhen Huazhimei Semiconductor Co., Ltd

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the feedback network must tie directly to the AGND pin. Connecting the
network to the PGND can inject noise into the system and effect
performance.
The feedback network, resistors R1 and R2 must be connected to FB pin
directly as closely as possible. And FB is a sensitive signal node, trace
area at FB pin should be small.
Please keep FB away from the inductor and SW switching node on the
PCB layout to minimize copper trace connections that can inject noise into
the system.
9
AGND
I
Analog Ground. The analog ground ties to all of the noise sensitive
signals. Provide a clean ground for the analog control circuitry and should
not be in the path of large currents.
Return for output voltage set resistor divider.
Connect this pin to PGND.
10
LBO
O
Low Battery Comparator Output (open drain).
(1) I = input; O = output; P = power
ABSOLUTE MAXIMUM RATINGS(1)
PARAMETER
SYMBOL
RATINGS
UNITS
CE Voltage(2)
VCE
VOUT+0.3
V
Other Pins Voltage(2)
6
V
Power Dissipation(3)
QFN2.1X2.1-10
PD@TA=25℃
2.5
W
Package Thermal Resistance(4)
θ
JA
50
°C /W
θ
JC
10
°C /W
Operating Junction Temperature Range
Tj
150
°C
Lead Temperature(Soldering, 10 sec)
Tsolder
260
°C
Storage Temperature Range
Tstg
-65~150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods
my affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to
ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = [ TJ(MAX)-TA ]/ θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent damage.
(4) θJA is measured in the natural convection at TA=25℃ on a four-layer Chipower Evaluation Board
5 A, 500KHz Synchronous Boost Converter with Output Disconnect
HM7065



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