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BAV70 Datasheet(PDF) 1 Page - Toshiba Semiconductor

Part # BAV70
Description  Switching Diodes Silicon Epitaxial Planar
PDF  5 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

BAV70 Datasheet(HTML) 1 Page - Toshiba Semiconductor

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BAV70
1
Switching Diodes Silicon Epitaxial Planar
BAV70
BAV70
BAV70
BAV70
Start of commercial production
2016-08
1.
1.
1.
1. Applications
Applications
Applications
Applications
•
Ultra-High-Speed Switching
2.
2.
2.
2. Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
SOT23
1: Anode 1
2: Anode 2
3: Cathode
3.
3.
3.
3. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Peak reverse voltage
Reverse voltage
Average rectified current
Peak forward current
Non-repetitive peak forward surge current
Power dissipation
Junction temperature
Storage temperature
Symbol
VRM
VR
IO
IFM
IFSM
PD
Tj
Tstg
Note
(Note 1)
(Note 1)
(Note 1), (Note 2)
(Note 3)
Rating
100
100
215
500
2
150
320
150
-55 to 150
Unit
V
mA
A
mW
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Unit rating. Total rating = Unit rating × 1.5
Note 2: Measured with a 10 ms pulse.
Note 3: Mounted on an FR4 board (25.4 mm × 25.4 mm × 1.6 mmt, Cu pad: 0.42 mm2 × 3)
2016-10-20
Rev.1.0
©2016 Toshiba Corporation


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