CTS521

1

Schottky Barrier Diode Silicon Epitaxial

CTS521

CTS521

CTS521

CTS521

Start of commercial production

2012-02

1.

1.

1.

1. Applications

Applications

Applications

Applications

•

High-Speed Switching

2.

2.

2.

2. Features

Features

Features

Features

(1)

(2)

Thin and compact package : Thickness = 0.40 mm (max)

3.

3.

3.

3. Packaging and Internal Circuit

Packaging and Internal Circuit

Packaging and Internal Circuit

Packaging and Internal Circuit

CST2

1: Cathode

2: Anode

4.

4.

4.

4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

= 25

= 25

= 25





))))

Characteristics

Reverse voltage

Peak forward current

Average rectified current

Non-repetitive peak forward surge current

Power dissipation

Junction temperature

Storage temperature

Operating temperature

Symbol

Note

(Note 1)

(Note 2)

Rating

30

300

200

1

150

125

-55 to 125

-40 to 100

Unit

V

mA

A

mW



Note:

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Measured with a 10 ms pulse.

Note 2: Mounted on a glass-epoxy circuit board of 20 mm × 20 mm, Pad dimension of 4 mm × 4 mm.

2014-04-04

Rev.3.0