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ESDM3033 Datasheet(PDF) 1 Page - ON Semiconductor |
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ESDM3033 Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 7 page ![]() © Semiconductor Components Industries, LLC, 2020 June, 2020 − Rev. 1 1 Publication Order Number: ESDM3033/D ESD Protection Diode Micro−Packaged Diodes for ESD Protection ESDM3033 The ESDM3033 is designed to protect voltage sensitive components that require low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Features • Low Clamping Voltage • Small Body Outline Dimensions: 1.0 mm x 0.6 mm • Low Body Height: 0.37 mm • Stand−off Voltage: 3.3 V • IEC61000−4−2 Level 4 ESD Protection • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • USB ID Line Protection • mSD Card Protection • Audio Line Protection • GPIO MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±30 ±30 kV Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient °PD° RqJA 250 400 mW °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. Device Package Shipping† ORDERING INFORMATION www.onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAM 1 2 ESDM3033N2T5G X2DFN2 (Pb−Free) 8000 / Tape & Reel X2DFN2 CASE 714AB JP M JP = Specific Device Code M = Date Code |
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