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ESDM3033 Datasheet(PDF) 1 Page - ON Semiconductor

Part # ESDM3033
Description  ESD Protection Diode Micro?뭁ackaged Diodes for ESD Protection
PDF  7 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

ESDM3033 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2020
June, 2020 − Rev. 1
1
Publication Order Number:
ESDM3033/D
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
ESDM3033
The ESDM3033 is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium.
Features
• Low Clamping Voltage
• Small Body Outline Dimensions: 1.0 mm x 0.6 mm
• Low Body Height: 0.37 mm
• Stand−off Voltage: 3.3 V
• IEC61000−4−2 Level 4 ESD Protection
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• USB ID Line Protection
• mSD Card Protection
• Audio Line Protection
• GPIO
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±30
±30
kV
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
°PD°
RqJA
250
400
mW
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
°C
Lead Solder Temperature − Maximum
(10 Second Duration)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
Device
Package
Shipping†
ORDERING INFORMATION
www.onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MARKING
DIAGRAM
1
2
ESDM3033N2T5G
X2DFN2
(Pb−Free)
8000 / Tape &
Reel
X2DFN2
CASE 714AB
JP M
JP = Specific Device Code
M
= Date Code


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