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MCP6V26 Datasheet(PDF) 33 Page - Microchip Technology |
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MCP6V26 Datasheet(HTML) 33 Page - Microchip Technology |
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33 / 50 page ![]() © 2011 Microchip Technology Inc. DS25007B-page 33 MCP6V26/7/8 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead TDFN (2x3x0.75 mm) (MCP6V26, MCP6V28) Example Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 8-Lead DFN (4x4x0.9 mm) (MCP6V27)Example YYWW NNN XXXXXX XXXXXX PIN 1 PIN 1 3 e 6V27 E/MD 1129 256 8-Lead MSOP (3x3 mm) Example 6V27E 129256 8-Lead SOIC (3.90 mm) Example NNN MCP6V27E SN^^ 1129 256 3 e Device Code MCP6V26T-E/MNY ABA MCP6V28T-E/MNY ABB ABA 129 25 |
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