HMC424ACHIPS

Data Sheet

Rev. B | Page 2 of 11

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 4

Thermal Resistance ...................................................................... 4

ESD Caution.................................................................................. 4

Pin Configuration and Function Descriptions............................. 5

Interface Schematics..................................................................... 5

Typical Performance Characteristics ............................................. 6

Insertion Loss, Return Loss, State Error, Step Error, and

Relative Phase ................................................................................6

Input Power Compression and Third-Order Intercept............8

Theory of Operation .........................................................................9

Power Supply..................................................................................9

RF Input and Output ....................................................................9

Applications Information .............................................................. 10

Mounting and Bonding Techniques ........................................ 10

Assembly Diagram ..................................................................... 10

Outline Dimensions....................................................................... 11

Ordering Guide .......................................................................... 11

REVISION HISTORY

3/2020—Rev. 01.1115 to Rev. B

This Hittite Microwave Products data sheet has been reformatted to

meet the styles and standards of Analog Devices, Inc.

Changes to Title, Features Section, Applications Section, and

General Description Section........................................................... 1

Changes to Table 1............................................................................ 3

Added Table 2, Figure 2, Thermal Resistance Section, and

Table 3; Renumbered Sequentially ................................................. 4

Changes to Table 2............................................................................ 4

Deleted Bias Voltage & Current Table and Control Voltage

Table; Renumbered Sequentially .................................................... 5

Added Figure 3, Table 4, and Figure 4 ........................................... 5

Changes to Figure 5.......................................................................... 5

Added Insertion Loss, Return Loss, State Error, Step Error, and

Relative Phase Section, Figure 8, Figure 9, and Figure 12........... 6

Changes to Figure 7, Figure 10, and Figure 11 ............................. 6

Added Figure 13, Figure 14, and Figure 16................................... 7

Changes to Figure 15........................................................................ 7

Deleted Handling Precautions Section, Mounting Section, and

Wire Bonding Section.......................................................................7

Added Input Power Compression and Third-Order Intercept

Section, Figure 18 to Figure 20, and Figure 22..............................8

Changes to Figure 17 and Figure 21 ...............................................8

Added Theory of Operation Section, Power Supply Section, and

RF Input and Output Section...........................................................9

Changes to Figure 23.........................................................................9

Added Applications Information Section ................................... 10

Changed Mounting & Bonding Techniques for Millimeterwave

GaAs MMICs Section to Mounting and Bonding Techniques

Section.............................................................................................. 10

Changes to Mounting and Bonding Techniques Section,

Figure 24, and Figure 25................................................................ 10

Updated Outline Dimensions....................................................... 11

Changes to Ordering Guide.......................................................... 11