ACE24LA1024A

Two-wire Serial EEPROM

VER 1.3

15

Packaging information

TSSOP-8

Notes:

1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper

dimensions, tolerances, datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall

not exceed 0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed

0.25 mm (0.010 in) per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess

of the b dimension at maximummaterial condition. Dambar cannot be located on the lower radius of the foot.

Minimum space between protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

SYMBOL

MIN

NOM

MAX

NOTE

D

2.90

3.00

3.10

2,5

E

6.40BSC

E1

4.30

4.40

4.50

3,5

A

1.20

A2

0.80

1.00

1.05

b

0.19

0.30

4

e

0.65BC

L

0.45

0.60

0.75

L1

1.00REF