S3Q

Taiwan Semiconductor

2

Version: C2102

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

16

°C/W

Junction-to-ambient thermal resistance

47

°C/W

Junction-to-case thermal resistance

17

°C/W

Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage

(1)

0.88

-

V

0.93

1.15

V

0.75

-

V

0.81

0.95

V

(2)

-

10

µA

-

150

µA

Junction capacitance

27

-

pF

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

S3Q

DO-214AB (SMC)

3,000 / Tape & Reel