S1Q

Taiwan Semiconductor

2

Version: B2102

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

22

°C/W

Junction-to-ambient thermal resistance

55

°C/W

Junction-to-case thermal resistance

25

°C/W

Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage

(1)

0.89

-

V

0.95

1.10

V

0.77

-

V

0.84

0.96

V

(2)

-

1

µA

-

30

µA

Junction capacitance

8

-

pF

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

S1Q

DO-214AC (SMA)

7,500 / Tape & Reel