Custom MMIC

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Assembly Guidelines

Assembly Diagram

Applications Information

The backside of the CMD247 is RF ground. Die attach should be accomplished with electrically and

thermally conductive epoxy only. Eutectic attach is not recommended. Standard assembly procedures

should be followed for high frequency devices. The top surface of the semiconductor should be made

planar to the adjacent RF transmission lines, and the RF decoupling capacitors placed in close proximity

to the DC connections on chip.

RF connections should be made as short as possible to reduce the inductive effect of the bond wire. Use

of a 0.8 mil thermosonic wedge bonding is highly recommended as the loop height will be minimized.

The RF input and output require a double bond wire as shown.

The semiconductor is 100 um thick and should be handled by the sides of the die or with a custom collet.

Do not make contact directly with the die surface as this will damage the monolithic circuitry. Handle

with care.

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions

should be observed during handling, assembly and test.

CMD247

CMD247

CMD247

30-40 GHz Low Phase Noise Amplifier

100 pF CHIP CAPS

100,000 pF CHIP CAPS

to Vdd

to Vgg

RF out

RF in

(example: Presidio part

MVB4080X104ZGK5R3L)

(example: Presidio part

LSA1515B101M2H5R-L)

ver 1.0 0816