Custom MMIC

300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294

Visit us online at www.custommmic.com

ver 1.1 0819

Die Outline (all dimensions in microns)

Notes:

1. No connection required for unlabeled pads

2. Backside is RF and DC ground

3. Backside and bond pad metal: Gold

4. Die is 70 microns thick

5. DC bond pads (2,3,4) are 100 x 100 microns

6. RF bond pads (1,5) are 100 x 150 microns

Mechanical Information

CMD299

18-40 GHz Low Noise Amplifier

1

2

3

4

5

105.00

2300.00

703.50

1195.00

1300.00

105.00

405.00

1925.00