MAX2180A datasheet(4/9 Pages) MAXIM

4 / 9 page

MaximIntegrated│ 4

MAX2180A Evaluation Kit

Evaluates: MAX2180A

www.maximintegrated.com

Layout Considerations

Electrical

Athigh-signal-levelconditions,theRFcurrentsflowingin

thedevicecaninducevoltagesinthePCBgroundplane,

known as “ground bounce.” To avoid unwanted spurious

productsinthesignalpathduetogroundbounce,proper

grounding techniques must be followed.

To prevent ground bounce from large FM signals entering

theAMsignalpath,theAMbypasscapacitorC3andAM

input resistor R17 must be grounded directly to ground

pins 8 and 9.

Thermal

The device is designed to meet data sheet specifications

atsupplyvoltagesupto+15V,andtofunctionatsupply

voltagesupto+24V.Undertheseconditions,asignificant

amount of power must be dissipated by the circuit. This

requires the application PCB to provide a low thermal

impedance path to a thermal ground.

The EV kit PCB design accounts for this by providing

an array of thermal vias in the ground plane and a wide

top metal trace connecting the package pad to a nearby

screw. Adjacent pins 20–23 are all grounded, which

allows the wide trace.

MAX2180A Datasheet(PDF) 4 Page - Maxim Integrated Products