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STPAC01F2 Datasheet(PDF) 5 Page - STMicroelectronics |
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STPAC01F2 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() STPAC01F2 5/7 Figure 11: FLIP-CHIP Package Mechanical Data Figure 12: Foot print recommendations Figure 13: Marking 1.57mm ± 50µm 315µm ± 50 500µm ± 50 650µm ± 65 Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter 365 240 x y x w z w All dimensions in µm E Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) |
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