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NOTE : All Specification subject to change without notice
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49
Electrical Characteristics(23℃)
Max Time to Trip
Resistance
Tolerance
Hold
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
Power
Current
Time
R MIN
R1 MAX
Part
Number
IH,A
IT,A
VMAX,Vdc
IMAX, A
Pd, W
A
Sec
Ω
Ω
FSMD005-1206
0.05
0.15
60
10
0.4
0.25
1.50
3.60
50.00
FSMD010-1206
0.10
0.25
60
10
0.4
0.50
1.00
1.60
15.00
FSMD020-1206
0.20
0.40
30
10
0.4
8.00
0.05
0.60
2.50
FSMD035-1206
0.35
0.75
16
40
0.4
8.00
0.10
0.30
1.20
FSMD050-1206
0.50
1.00
8
40
0.4
8.00
0.10
0.15
0.70
FSMD075-1206
0.75
1.50
6
40
0.6
8.00
0.20
0.10
0.29
FSMD100-1206
1.00
1.80
6
40
0.6
8.00
0.30
0.055
0.210
FSMD150-1206
1.50
3.00
6
40
0.8
8.00
1.00
0.040
0.120
IH=Hold current-maximum current at which the device will not trip at 23
℃still air.
IT=Trip current-minimum current at which the device will always trip at 23 ℃ still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I max)
I MAX= Maximum fault current device can withstand without damage at rat ed voltage (V max).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23
℃ still air environment.
RMIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23
℃ measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : solder-plated copper
※ Lead Free Component
Application:
All high-density boards
Product Features:
Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 50mA~1.5A
Maximum Voltage: 6V~60V
Temperature Range: -40℃ to 85℃
Agency Recognition: Pending
FSMD1206 Series
Surface Mount PTC
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