Table 5-3. Classification Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

3 °C/second max

3 °C/second max

Preheat

100 °C

150 °C

150 °C

200 °C

60 s to 120 s

60 s to 180 s

Time Maintained

183 °C

217 °C

60 s to 150 s

60 s to 150 s

Peak classification temperature (TP)

210 °C to 235 °C

240 °C to 255 °C

Time within 5 °C of actual peak temperature

(tp)

10 s to 30 s

20 s to 40 s

Ramp-down rate

6 °C/second max

6 °C/second max

Time 25 °C to peak temperature

6 minutes max

8 minutes max

Figure 5-7. Classification Reflow Profiles

Table 5-4. Pb-Free Process—Package Classification Reflow Temperatures

Package Thickness

260 + 0 °C

260 + 0 °C

260 + 0 °C

260 + 0 °C

250 + 0 °C

245 + 0 °C

Greater than or equal to

250 + 0 °C

245 + 0 °C

245 + 0 °C

1.

Tolerance: The device manufacturer or supplier should assure process compatibility up to and including the

stated classification temperature, meaning that the Peak reflow temperature is +0 °C. For example, 260 °C to

0 °C, at the rated MSL value.

Note: Exceeding the ratings that are mentioned in the preceding table might cause damage to the device.

PD69208T4/PD69204T4/PD69208M

Package Information

Datasheet

DS00003428C-page 27