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MOC3063M. Datasheet(PDF) 7 Page - ON Semiconductor |
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MOC3063M. Datasheet(HTML) 7 Page - ON Semiconductor |
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7 / 12 page ![]() MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M www.onsemi.com 7 Time (seconds) Time 25°C to Peak 260 240 220 200 180 160 140 120 100 80 60 40 20 0 TL ts tL tP TP Tsmax Tsmin 120 Preheat Area Max. Ramp−up Rate = 3°C/S Max. Ramp−down Rate = 6°C/S 240 360 Profile Freature Pb−Free Assembly Profile Temperature Minimum (Tsmin) 150°C Temperature Maximum (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60 seconds to 120 seconds Ramp−up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 seconds to 150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp−down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Figure 11. Reflow Profile |
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