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ADL8150ACHIP Datasheet(PDF) 1 Page - Analog Devices

Part # ADL8150ACHIP
Description  GaAs, HBT, MMIC, Low Phase Noise Amplifier, 6 GHz to 14 GHz
PDF  14 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADL8150ACHIP Datasheet(HTML) 1 Page - Analog Devices

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GaAs, HBT, MMIC, Low Phase Noise
Amplifier, 6 GHz to 14 GHz
Data Sheet
ADL8150ACHIP
Rev. 0
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevicesforitsuse,norforanyinfringementsofpatentsorother
rights of third parties that may result from its use. Specifications subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Analog
Devices.Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2020 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
FEATURES
Output P1dB: 19 dBm (typical at 7 GHz to 11 GHz)
PSAT: 23 dBm (typical at 7 GHz to 14 GHz)
Gain: 13 dB (typical at 7 GHz to 11 GHz)
Output IP3: 31.5 dBm (typical at 7 GHz to 11 GHz)
Phase noise: −172 dBc/Hz at 10 kHz offset
VCC: 5 V at ICQ = 76 mA
Die size: 1.490 mm × 0.930 mm × 0.102 mm
APPLICATIONS
Military and space
Test instrumentation
FUNCTIONAL BLOCK DIAGRAM
1
2
ADL8150ACHIP
RFOUT/VCC
RFIN
Figure 1.
GENERAL DESCRIPTION
The ADL8150ACHIP is a self biased, gallium arsenide (GaAs),
monolithic microwave integrated circuit (MMIC), heterojunction
bipolar transistor (HBT), low phase noise amplifier that operates
from 6 GHz to 14 GHz. The amplifier provides 13 dB of gain,
19 dBm output power for 1 dB gain compression (P1dB), and
an output third-order intercept (IP3) of 31.5 dBm at 7 GHz to
11 GHz. The amplifier requires 76 mA of quiescent collector
supply current (ICQ) from a 5 V supply voltage (VCC). The
ADL8150ACHIP also features inputs and outputs (I/Os) that are
internally matched to 50 Ω and facilitates integration into
multichip modules (MCMs). All data is taken with the chip
connected via two wire bonds that are 0.025 mm (1 mil) wide and
0.31 mm (12 mil) long.


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