Issue 2 - October 2005

1

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© Zetex Semiconductors plc 2005

Package information - MLP832

Surface mounted, 8 pin package

Package outline

Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches

Soldering footprint

DIM

Millimeters

Inches

DIM

Millimeters

Inches

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

A

0.80

1.00

0.0315

0.0394

e

0.65 BSC

0.0256 BSC

A1

0.00

0.05

0.00

0.002

E

2.00 BSC

0.0787 BSC

A2

0.65

0.75

0.0256

0.0295

E2

0.43

0.63

0.017

0.0248

A3

0.15

0.25

0.006

0.0098

L

0.20

0.45

0.0079

0.0177

b

0.24

0.34

0.0095

0.0134

L2

0.00

0.125

0.00

0.005

b1

0.17

0.30

0.0068

0.0118

r

0.075 BSC

0.0029 BSC

D

3.00 BSC

0.118 BSC

0

°

12

°

0

°

12

°

D2

0.82

1.02

0.0323

0.0402

-

-

-

-

-

D3

1.01

1.21

0.0398

0.0476

-

-

-

-

-

0.40

0.015

0.80

0.031

0.10

0.004

1.20

0.047

1.30

0.051

0.65

0.025

0.75

0.029

0.9

0.035

0.35

0.013