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EM6125 Datasheet(PDF) 39 Page - EM Microelectronic - MARIN SA |
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EM6125 Datasheet(HTML) 39 Page - EM Microelectronic - MARIN SA |
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39 / 43 page ![]() EM6125 Copyright 2001, EM Microelectronic-Marin SA 39 www.emmicroelectronic.com 10 Pad location Figure 39 Mechanical Dimensions: Typical value Unit Minimum pad pitch 70 µm Bump size pads from S[0] to S[183] 50 ×100×17.5 µm Bump size interface pads 102 ×102×17.5 µm Bump hardness 50 Vickers Wafer thickness 380 µm Chip Size 7775 ×2175 µm x center y center 90 µm 90 µm 30 µm 30 µm 30 µm x center y center 90 µm 90 µm 30 µm 30 µm MARK 1 : x = - 61, y = 209 MARK 2 : x = 7397, y = 209 |
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