MAX17119 Evaluation Kit

4 ______________________________________________________________________________________

Power-Supply Configurations

The EV kit requires two positive power supplies and one

negative power supply for proper evaluation of the kit.

GON1 and GON2 require a +12V to +38V power supply

that provides up to 1A of current. GOFF requires a -12V

to -2V power supply that provides up to 1A of current.

Jumper JU11 configures the input power source for

GON2. Install a shunt across pins 1-2 of jumper JU11

to select GON1 as the input power source for GON2.

Install a shunt across pins 2-3 of jumper JU11 to apply

an external power source across the GON2 and PGND

PCB pads. Buffers Y8 and Y9 output the voltage applied

at the GON2 PCB pad. See Table 2 for proper jumper

JU11 configuration.

Additional surface-mount 1206 PCB pads are provided

for adding additional bulk capacitance at C91, C92, and

C93 when interfacing long wires to the EV kit’s GON1,

GON2, and GOFF power-supply inputs.

Output Load Connection

The EV kit provides resistor/capacitor loads for each

output channel to mimic TFT-LCD panel load models for

easy evaluation of the EV kit. Install shunts across jump-

ers JU1–JU11 to connect the RC loads to the IC’s scan-

driver outputs. Place scope probes across the shunts

installed at jumpers JU1–JU10 for proper evaluation

of the MAX17119 buffers (Y1–Y10), when applying

input signals through the SIGNAL_IN PCB pad, P1

header, or J1 header. Test points TP1–TP10 can be

used to monitor the loaded buffer outputs when applying

static DC voltages at the A1–A9 inputs.

Inputs (A_) Logic-Level Selection

(JU12–JU20)

Jumpers JU12–JU21 configure the EV kit’s A1–A9 inputs

to accept either a DC voltage or square-wave input

signal. Install a shunt across pins 1-2 of the individual

channels to use a square-wave signal applied at the

SIGNAL_IN PCB pad and J1 or P1 headers. The square-

wave signal should have a +2V to +5.5V logic-high

level. Place scope probes across the shunts installed

at jumpers JU2–JU11 for proper evaluation of the

MAX17119 scan-driver outputs (Y1–Y9 and YDCHG).

Install a shunt across pins 2-3 of the individual channels

to configure the inputs to static logic-low or logic-high

DC levels. DIP switch SW1 sets the buffer inputs to a

logic-high level using the output of LDO regulator (U2)

and potentiometer R60. Set SW1 to the on position to

place a logic-high voltage at the inputs. Set SW1 to the

off position to place a logic-low voltage at the inputs

through pulldown resistors R47–R55.

Table 2. GON2 Power Source Selection

(JU11)

Table 3. Output Load Connection

(JU1–JU10)

SHUNT

POSITION

GON2 IC PIN

GON2 INPUT

RANGE (V)

1-2

Connected to GON1

—

2-3

Connected to external

power source at GON2

and PGND PCB pads

+12 to +38

SHUNT

POSITION

MAX17119 Y1–

Y9 AND YDCHG

OUTPUTS

EV KIT

FUNCTION

Installed

Connected to RC

loads

Outputs monitored

at shunts

Not installed

Disconnected from

RC load

No-load condition

for scan drivers