2R-5 datasheet(5/5 Pages) LEIDITECH

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Soldering Parameters - Wave soldering (Thru-Hole Devices)

Wave Soldering Condition

Pb-Free assembly

Prehe

Temperature Min

100

°C

Temperature Max

150

°C

Time (Min to Max)

60-180 Seconds

Solder Pot Temperature

280

°C Max

Solder Dwell Time

2-5 Seconds

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Reflow Condition

Pb - Free assembly

Prehe

-Temperature Min (Ts(min))

150

°C

-Temperature Max (Ts(max))

200

°C

- Time (min to max) (ts)

60 -180 Seconds

Average ramp up rate ( Liquids Temp TL) to

peak

°C/second max

TS(max) to TL - Ramp-up Rate

°C/second max

Reflo

- Temperature (TL) (Liquids)

217

°C

- Time (min to max) (ts)

60 -150 Seconds

Peak Temperature (TP)

260 +0/-5

°C

Time within 5

°C of actual peak Temperature

(tp)

10 - 30 Seconds

Ramp-down Rate

°C/second max

Time 25

°C to peak Temperature (T

8 minutes Max

Do not exceed

260

°C

300

280

260

240

220

200

180

160

140

120

100

Time(Seconds)

Preheat Time

Dwell Time

Cooling Time

Ramp-down

Preheat

Critical Zone

TL to TP

Time to peak temperature

(t 25℃ to peak)

TS(max)

TS(min)

Ramp-up

Time

2R-5 Series

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

Rev :

www.leiditech.com

01.06.2016

5/5

2R-5 Datasheet(PDF) 5 Page - Shanghai Leiditech Electronic Technology Co., Ltd

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