MAX9679B datasheet(4/27 Pages) MAXIM

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12-Channel, 10-Bit Programmable Gamma

and VCOM Reference Voltages

(All voltages are with respect to AGND.)

Supply Voltages

AVDD1, AVDD2, AVDD_AMP............................-0.3V to +22V

DVDD...................................................................-0.3V to +4V

Outputs

GMA1–GMA6...................................-0.3V to (VAVDD1 + 0.3V)

GMA7–GMA12.................................-0.3V to (VAVDD2 + 0.3V)

VCOM ....................................... -0.3V to (VAVDD_AMP + 0.3V)

Inputs

SDA, SCL, A0, BKSEL.........................................-0.3V to +6V

VCOM_FB................................. -0.3V to (VAVDD_AMP + 0.3V)

Continuous Current

SDA, SCL..................................................................... Q20mA

GMA1–GMA8............................................................. Q200mA

VCOM ........................................................................ Q600mA

Continuous Power Dissipation (TA = +70NC)

TQFN Multilayer Board

(derate 25.6mW/NC above +70NC) .........................2051.3mW

Junction Temperature .....................................................+125NC

Operating Temperature Range.......................... -40NC to +85NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VAVDD1 = 18V, VAVDD2 = VAVDD_AMP = 9V, VDVDD = 3.3V, VAGND = 0V, VCOM = VCOM_FB, programmable reference code = 905,

no load, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

TQFN

Junction-to-Ambient Thermal Resistance (

qJA) ..........39°C/W

Junction-to-Case Thermal Resistance (

qJC) .................6°C/W

PACKAGE THERMAL CHARACTERISTICS (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

SUPPLIES

AVDD1 Analog Supply Voltage

Range

VAVDD1

Guaranteed by PSRR

AVDD2 Analog Supply Voltage

Range

VAVDD2

Guaranteed by PSRR

AVDD_AMP Analog Supply

Voltage Range

VAVDD_AMP Guaranteed by PSRR

Digital Supply Voltage

VDVDD

2.7

3.6

AVDD1 Analog Quiescent

Current

IAVDD1

AVDD2 Quiescent Current

IAVDD2

AVDD_AMP Quiescent Current

IAVDD_AMP

Digital Quiescent Current

IDVDD

No SCL or SDA transitions

1.5

Thermal Shutdown

+160

Thermal-Shutdown Hysteresis

Analog Supply Voltage Range

for Programming MTP

MAX9679B Datasheet(PDF) 4 Page - Maxim Integrated Products

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