(All voltages referenced to GND, unless otherwise noted.)

DE, DI......................................................................-0.3V to +6V

Y, Z ........................................................................-7V to +12.5V

SOT23 (derate 8.2mW/°C above +70°C).................654.1mW

Operating Temperature Ranges

MAX32_ _AUT.............................................. -40°C to +125°C

Storage Temperature Range............................ -65°C to +160°C

Junction Temperature .....................................................+160°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

6 SOT23

Package Code

U6CN+2

Outline Number

21-0058

Land Pattern Number

90-0175

Thermal Resistance, Single-Layer Board:

122.3

84

Thermal Resistance, Multilayer Board:

74.6

6

MAX3293–MAX3295

20Mbps, +3.3V, SOT23 RS-485/

RS-422 Transmitters

www.maximintegrated.com

Maxim Integrated │ 2

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Absolute Maximum Ratings

Package Information

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.