MAX11190 datasheet(4/19 Pages) MAXIM

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MAX11190

4-Channel, Dual, Simultaneous Sampling,

2.2V to 3.6V, 12-Bit, 3Msps SAR ADC in Tiny

3mm x 3mm TQFN Package

www.maximintegrated.com

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Electrical Characteristics

(VDD = +2.2V to +3.6V, REFA = REFB = VDD, OVDD = VDD, unless otherwise noted. fSCLK = 48MHz, 3Msps, 50% duty cycle.

Reference pins are independent, CDOUTA/DOUTB = 10pF. TA = -40ºC to 125ºC, unless otherwise noted. Typical values are at

TA = +25ºC.) (Note 2)

VDD to GND .......................................................................-0.3V to +4V

AIN1A, AIN2A to GND....-0.3V to the lower of (VDD + 0.3V) and +4.0V

REFA, OVDD to GND ....-0.3V to the lower of (VDD + 0.3V) and +4.0V

AIN1B, AIN2B to GND....-0.3V to the lower of (VDD + 0.3V) and +4.0V

REFB to GND.................-0.3V to the lower of (VDD + 0.3V) and +4.0V

CS,SCLKtoGND..... -0.3V to the lower of (VOVDD + 0.3V) and +4.0V

CHSELtoGND ......... -0.3V to the lower of (VOVDD + 0.3V) and +4.0V

DOUTA to GND........... -0.3V to the lower of (VOVDD + 0.3V) and +4.0V

DOUTB to GND .......... -0.3V to the lower of (VOVDD + 0.3V) and +4.0V

Multilayer Board Max Power Dissipation (TA = +70ºC)

TQFN (derate 20.8mW/ºC above +70ºC)..................1667mW

Operating Temperature Range..........................-40ºC to +125ºC

Storage Temperature Range.............................-65ºC to +150ºC

LeadTemperature(soldering,10s) ................................. +300ºC

Soldering Temperature (reflow)....................................... +260ºC

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

TQFN

Junction-to-AmbientThermalResistance(θJA) ..........48°C/W

Junction-to-CaseThermalResistance(θJC)...............10°C/W

(Note 1)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC ACCURACY

Resolution

12 bit

Bits

Integral Nonlinearity

INL

±1

LSB

Differential Nonlinearity

DNL

No missing codes over temperature

±1

LSB

Offset Error

±1

±4.0

LSB

Gain Error

Excluding offset and reference errors

±1

±4.0

LSB

Total Unadjusted Error

TUE

±1.5

LSB

Channel-to-Channel Offset Matching

±0.3

LSB

Channel-to-Channel Gain Matching

±0.3

LSB

DYNAMIC PERFORMANCE

Signal-to-Noise Plus Distortion

(Note 3)

SINAD

fIN = 1MHz

Signal-to-Noise Ratio

SNR

fIN = 1MHz

70.5

Total Harmonic Distortion

THD

fIN = 1MHz

-85

-75

Spurious-Free Dynamic Range

SFDR

fIN = 1MHz

Intermodulation Distortion

IMD

fIN1 = 1.0003MHz, fIN2 = 0.99955MHz

-84

Full-Power Bandwidth

-3dB point

MHz

Full-LinearBandwidth

SINAD > 68dB

2.5

MHz

Small-Signal Bandwidth

MHz

Crosstalk

Channel to channel

-90

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