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SS56A Datasheet(PDF) 7 Page - FutureWafer Tech Co.,Ltd |
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SS56A Datasheet(HTML) 7 Page - FutureWafer Tech Co.,Ltd |
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7 / 9 page ![]() SS52 A / B / C -SS510 A / B / C Document Number:F41806G 09-Aug-21 V 2.1 www.futurewafer.com.tw Schottky Barrier Diode 14.Taping and Reel Specification Taping Width Tape Orientation 12mm Direction Of Feed 15. Embossed Carrier Tape Specifications Dimension W B1 D D1 E F K P P0 P2 t W Value 12 mm 8.2 Max 1.5+ 0.1/- 1.5 Min. 1.75 ±0.10 5.5 ±0.05 4.5 Max. 8.0 ±0.10 4.0 ±0.10 2.0 ±0.05 0.4 Max. 12 ±0.3 A0 / B0 / K0 Determined by Component Size. The Clearance Between the Component And The Cavity Must Comply to The Rotational And Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. |
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