ADP2387ACPZN-R7 datasheet(25/25 Pages) AD

25 / 25 page

Data Sheet

ADP2387

Rev. C | Page 25 of 25

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.25

0.20

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD .

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

0.20 MIN

0.20

MIN

0.20

MIN

0.20

MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PADS, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.80

2.70

2.60

1.05

0.95

0.85

0.45

0.35

0.25

1.50

1.40

1.30

EXPOSED

PAD

EXPOSED

PAD

Figure 41. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-24-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP2387ACPZN-R7

−40°C to +125°C

24-Lead Lead Frame Chip Scale Package [LFCSP_WQ], 7”Tape and Reel

CP-24-12

ADP2387-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D12643-0-4/17(C)

ADP2387ACPZN-R7 Datasheet(PDF) 25 Page - Analog Devices

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