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USB7006 Datasheet(PDF) 38 Page - Microchip Technology |
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USB7006 Datasheet(HTML) 38 Page - Microchip Technology |
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38 / 55 page ![]() USB7006 DS00003715A-page 38 2021 Microchip Technology Inc. 9.3 Package Thermal Specifications FIGURE 9-1: SUPPLY RISE TIME MODEL Note: The Power Supply Rise time requirement does not apply if the RESET_N signal is held low during power on and released after power levels rise and stabilize above the power on thresholds, or if the RESET_N signal is toggled after power supplies become stable. TABLE 9-1: PACKAGE THERMAL PARAMETERS Symbol °C/W Velocity (Meters/s) JA 19 0 16 1 14 2.5 JT 0.1 0 0.1 1 JB 9 0 JC 1.3 0 1.3 1 JB 10 - Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51. For industrial applications, the USB7006 requires multi-layer 2S4P PCB power dissipation. t10% 10% 90% Voltage TRT t90% Time 100% 3.3 V VSS VDD33 90% 100% VCORE |
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