Light Touch Switches/EVPAV

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

– ES107 –

General dimension tolerance :

± 0.1

( )dimensions are reference dimensions.

This reference specifications are subject to change.

1

2

3

4

Circuit Diagram

1

2

3

4

81 These dimensions are

from the outer shape

to the center of push plate.

82 These dimensions are

from the center of datum A.

This product is designed to be smaller

than the conventional type, which lowered

the film peel off strength. Therefore please

avoid to apply force to a push plate from

side, or/and avoid set-knob to touch push

plate during insertion to a set-case.

Soldering thickness t=0.1

±0.02

2.8

A

(

φ0.75)

φ0.6

2.3

±0.2

(2.8)

(1.88)

0.65

±0.15

2.00

±0.15

1.50

±0.05

PWB land pattern for reference

Push plate side

Push plate

Adhesive

0.92

±0.05

3.20

±0.05

180

260

MAX.

150

230

90

±30

40

±10

(Normal Temp.)

Soldering Time (s)

Fan or Normal Temp.

G

F

A

E

C

D

Taping condition : Lack of products in the middle of taping should be

one MAX, but total quantity specified in the

specifications should be secured.

Peeling off strength of top tape : It should be within 0.2N to 1. ON at

165 degree in peeling off angle.

Joint of carrier tape : One joint per one reel may exist.

Tape running direction

F

φG

D

E

I

Tape width=8.0 mm

Feeding hole

Chip

pocket

EVPAV

✻ Height from surface of PCB : 0.975 mm

Item

A

B

C

D

E

Rate (mm)

φ380.0±2.0 φ80.0±1.0 φ13.0±0.5 φ21.0±1.0

2.0±0.5

Item

F

G

Rate (mm)

9.4±1.0

13.4±1.0

Unit: mm

Part No.

Height

A

B

C

D

E

F

G

H

I

J

K

L

t

EVPAV

1.95

8.0±0.3 1.75±0.10 3.5±0.1

4.0±0.1

4.0±0.1

2.0±0.1

1.5

+0.1

3.1±0.2

2.8±0.2 1.35±0.20 2.7±0.2

(6.25)

0.3±0.1

0

Oct. 2012

00