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EK65 Datasheet(PDF) 5 Page - Cirrus Logic

Part # EK65
Description  Evaluation Kit
PDF  6 Pages
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Manufacturer  APEX [Cirrus Logic]
Direct Link  http://www.cirrus.com
Logo APEX - Cirrus Logic

EK65 Datasheet(HTML) 5 Page - Cirrus Logic

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EK65
EK65U Rev D
5
avoid making any connections between these two ground references at the board level. Note the dashed
line on the component side of the board showing the dividing line between the analog ground side of the
board and the power ground side.
3. Cut one of the MS11 strips to a length of 20 cage jacks and the other MS11 to a length of 22 cage jacks.
From the DUT side of the board, insert the strips into the appropriate row of holes for the DUT pins. On
the component side of the board, solder all cage jacks having solder pads (pins 3, 5, 7, 9, 11, and 16 have
no solder pads). Make sure the cage jacks are fully seated before soldering. Be careful that solder does not
flow into the cage jacks. Remove the unsoldered cage jacks with the carrier strip segments.
4. Solder the ZX7R105KTL surface mount capacitor at C1 on the component side of the board.
5. Insert BJ1 – BJ6 from the component side of the board as desired for your application. The banana jack
locations are labeled with the associated input or output. BJ1 is provided for use as an input for a negative
bias supply voltage to –Vs for bipolar supply operation. It also could be used as an alternative to the BNC
connector for the input signal or other inputs to your application circuit. If you do not anticipate using BJ1
it should be left off. Solder the banana jacks to the board from the DUT side.
6. Insert the BNC connector BN1 from the component side of the board. Solder to the board from the DUT
side. BN1 can be left off if you do not intend to use it for an input to your circuit.
7. Select and insert Rset from the component side of the board at the location shown near pin 34 of the DUT
and solder from the DUT side. Rtrim may be installed for calibration of the boost supply voltage or as an
alternative to Rset. If installed as shown on the board with the knob toward Cin, a CW turn will increase
Vboost and a CCW turn will decrease Vboost.
8. Select and insert Rcl from the component side at the location marked for Rcl between pins 1 and 2 of the
DUT. Solder from the DUT side.
9. Select and insert other components as required for your application. J1 is required to supply Vboost to the
high voltage op amp through the on board 47µH filter inductor. Vboost can be jumpered to the +Vs pin if
the filter is not to be used. Alternatives are to replace the jumper with an external inductor between the
Vboost pin and the LFin or +Vs. A filter capacitor can be added between the +Vs and AGND. You may
want to start with J1 as shown and try other options as you are evaluating your design.
10. J2 is required to connect the high voltage op amp –Vs to AGND for single supply operation. If an external
negative supply voltage will be used, replace J2 with a high quality ceramic bypass capacitor of at least
1µF, and jumper –Vs to BJ1. BJ1 can be used to connect the negative supply to the evaluation board.
11. Rin+ and Rin- when installed as marked on the component side of the board near BJ1 and BN1, will config-
ure the op amp in the non-inverting configuration with Rin- to AGND and Rin+ to the input BNC. For an
inverting configuration, rotate Rin+ to AGND and Rin- to the input.
12. If the snubber Cs and Rs will be used, select and insert the components at the location marked near DUT
pins 12 – 15. If the calculated power dissipation indicates that a heat sink is required for Rs, install it with
Rs. Cs and Rs can be installed after you have started evaluating your design if they are found to be
needed.
13. Vin power can be supplied to your circuitry in the breadboard area. There are two pads located below the
breadboard area near BN1. One labeled Vin and one labeled PGND can be jumpered into your circuit as
needed.
14. Mount the electrolytic capacitors at Cin, and Cboost from the component side of the PCB. Match the
polarity markings on the PCB. Solder from the DUT side of the PCB. Be sure to fill the holes with solder.
15. Apply a thin, uniform layer of thermal grease to the back side of the MP400FC. Position the amplifier over
the mounting holes of the HS26 heat sink. Firmly push the amplifier onto the heat sink while slightly
rotating the amplifier back and forth, ending with the mounting holes of the amplifier over the mounting
holes in the heat sink.



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