832WC datasheet(4/8 Pages) ETC

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832WC

ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008

Date: 07 February 2020 / Ver. 2.02

Page 4

Cured Properties

Electrical Properties a)

Method

Value

Breakdown voltage @2.3 mm

ASTM D 149

41 000 V [41 kV]

Dielectric strength @2.3 mm

ASTM D 149

465 V/mil [18 kV/mm]

Breakdown voltage @3.175 mm [1/8"]

Reference fit a)

49 000 V [49 kV]

Dielectric strength @3.175 mm [1/8”]

Reference fit a)

394 V/mil [16 kV/mm]

Volume resistivity

ASTM D 257

1.6 x 1017

Ω·cm

Volume conductivity

ASTM D 257

6.3 x 10-18 S/cm

Dielectric dissipation, D @1 MHz

ASTM D 150-11

0.028

Dielectric constant, k’ @1 MHz

ASTM D 150-11

3.23

Thermal Properties

Method

Value

Glass transition temperature (Tg)

ASTM E 831

33 °C [91 °F]

CTE b) prior Tg

after Tg

ASTM E 831

80 ppm/°C [176 ppm/°F]

192 ppm/°C [378 ppm/°F]

Note: Specifications are for epoxy samples cured at 80 °C for 1 h and conditioned at ambient temperature

and humidity.

a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher

equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8" (3.175 mm).

b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6

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