Die Size (Unsawn)

1650 x 1500

65 x 59

µm

mils

Advanced CMOS Logic – 54AC273

8-bit D-Type Flip-Flop with common reset and clock inputs in bare die form

Rev 1.0

07/12/2021



Buffered common clock



Buffered asynchronous master reset



Outputs Source/Sink 24mA



Low input current: 1µA



Outputs directly interface CMOS, NMOS and TTL



Operating voltage range: 2.0V to 6.0V



Function compatible with 54HC273



Full military temperature range.

Features:

Ordering Information

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection



“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (100 per tray capacity)

The 54AC273 consists of eight D-type flip-flops fabricated

using a 1.5µm 5V CMOS process combining high speed

performance LSTTL performance with CMOS low power

consumption. Each flip-flop is equipped with buffered

common Clock (CP) and common Reset (MR) inputs. A

low-to-high clock transition loads each flip-flop. Reset is

asynchronous and enabled with active low. Inputs accept

standard CMOS outputs or LSTTL outputs using pull-up

resistors. Inputs are also equipped with protection circuits

against static discharge and transient excess voltage.

Description

Die Dimensions in µm (mils)

1650 (65)



Sawn Wafer on Tape – On request

108 x 108

µm

Minimum Bond Pad Size

4.25 x 4.25

mils



Unsawn Wafer – On request

460 (±20)

µm

Die Thickness

18.11 (±0.79)

mils



Die Thickness <> 460µm(18 Mils) – On request

Top Metal Composition

Al 1%Si 1.1µm



Assembled into Ceramic Package – On request

Back Metal Composition

N/A – Bare Si

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