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74HC241 Datasheet(PDF) 1 Page - Silicon Supplies

Part # 74HC241
Description  High Speed CMOS Logic
PDF  6 Pages
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Manufacturer  SS [Silicon Supplies]
Direct Link  https://siliconsupplies.com/
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74HC241 Datasheet(HTML) 1 Page - Silicon Supplies

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High Speed CMOS Logic – 74HC241
Octal 3-State Non-Inverting Buffer / Line Driver / Line Receiver in bare die form
Rev 1.0
30/11/21
Output Drive Capability: 15 LSTTL Loads
Low Input Current: 1µA
Outputs directly interface CMOS, NMOS and TTL
Operating Voltage Range: 2V to 6V
CMOS High Noise Immunity
Function compatible with 74LS241
Lower power alternative to Bipolar or BiCMOS logic
Features:
Ordering Information
Description
Die Dimensions in µm (mils)
The 74HC241 is produced on a 2.5µm 5V CMOS process
combining high speed LSTTL performance with CMOS low
power. The device can be used as two 4-bit buffers or one
8-bit buffer & features non-inverting inputs with two output
enables, each controlling four of the 3-state outputs. The
device improves performance & density in clock drivers, 3-
state memory address drivers & bus orientated transmitters
and receivers. Device inputs are compatible with standard
CMOS outputs; with pull-up resistors, they are compatible
with LSTTL outputs. All inputs are equipped with protection
circuits against static discharge & transient excess voltage.
The following part suffixes apply:
No suffix - MIL-STD-883 /2010B Visual Inspection
1950 (77)
For High Reliability versions of this product please see
54HC241
Die Size (Unsawn)
1950 x 2050
77 x 81
µm
mils
Minimum Bond Pad Size
106 x 106
4.17 x 4.17
µm
mils
350 (±20)
13.78 (±0.79)
µm
Die Thickness
mils
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (100 per tray capacity)
Sawn Wafer on Tape – On request
Unsawn Wafer – On request
Die Thickness <> 350µm(14 Mils) – On request
Top Metal Composition
Al 1%Si 1.1µm
Back Metal Composition
N/A – Bare Si
Assembled into Ceramic Package – On request
Page 1 of 6
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