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74HC241 Datasheet(PDF) 1 Page - Silicon Supplies |
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74HC241 Datasheet(HTML) 1 Page - Silicon Supplies |
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1 / 6 page ![]() High Speed CMOS Logic – 74HC241 Octal 3-State Non-Inverting Buffer / Line Driver / Line Receiver in bare die form Rev 1.0 30/11/21 Output Drive Capability: 15 LSTTL Loads Low Input Current: 1µA Outputs directly interface CMOS, NMOS and TTL Operating Voltage Range: 2V to 6V CMOS High Noise Immunity Function compatible with 74LS241 Lower power alternative to Bipolar or BiCMOS logic Features: Ordering Information Description Die Dimensions in µm (mils) The 74HC241 is produced on a 2.5µm 5V CMOS process combining high speed LSTTL performance with CMOS low power. The device can be used as two 4-bit buffers or one 8-bit buffer & features non-inverting inputs with two output enables, each controlling four of the 3-state outputs. The device improves performance & density in clock drivers, 3- state memory address drivers & bus orientated transmitters and receivers. Device inputs are compatible with standard CMOS outputs; with pull-up resistors, they are compatible with LSTTL outputs. All inputs are equipped with protection circuits against static discharge & transient excess voltage. The following part suffixes apply: No suffix - MIL-STD-883 /2010B Visual Inspection 1950 (77) For High Reliability versions of this product please see 54HC241 Die Size (Unsawn) 1950 x 2050 77 x 81 µm mils Minimum Bond Pad Size 106 x 106 4.17 x 4.17 µm mils 350 (±20) 13.78 (±0.79) µm Die Thickness mils Supply Formats: Mechanical Specification Default – Die in Waffle Pack (100 per tray capacity) Sawn Wafer on Tape – On request Unsawn Wafer – On request Die Thickness <> 350µm(14 Mils) – On request Top Metal Composition Al 1%Si 1.1µm Back Metal Composition N/A – Bare Si Assembled into Ceramic Package – On request Page 1 of 6 www.siliconsupplies.com |
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