7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage range

VCC

–0.3

7

V

Voltage range USB data

DxP, DxM

–0.3

5.5

V

Voltage range on BOOST pin

BOOST

-0.3

1.98

V

Voltage range other pins

RX_SEN,CDP_ENZ ,SDA,SCL, RSTN

-0.3

5.5

V

–65

150

°C

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011(2)

±750

(1)

AEC Q100-002 HBM ESD Classification Level 2

(2)

AEC Q100- 011 CDM ESD Classification Level C4A

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.3

5

6.5

V

Operating free-air temperature (AEC-Q100)

–40

105

°C

Junction temperature (AEC-Q100)

115

°C

I2C Bus Voltage

1.62

3.6

V

DxP, DxM

Voltage range USB data

0

3.6

V

BOOST

Voltage range BOOST pin

0

1.98

V

DIGITAL

Voltage range other pins (SCL, SDA, RSTN, CDP_ENZ, )

0

3.6

V

RX_SEN

Voltage range RX_SEN pin

0

5.0

V

7.4 Thermal Information

THERMAL METRIC (1)

RWB (X2QFN)

UNIT

12 PINS

Junction-to-ambient thermal resistance

137.4

°C/W

Junction-to-case (top) thermal resistance

62

°C/W

Junction-to-board thermal resistance

67.2

°C/W

Junction-to-top characterization parameter

1.9

°C/W

Junction-to-board characterization parameter

67.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TUSB216-Q1

SLLSF03A – APRIL 2019 – REVISED SEPTEMBER 2021

www.ti.com

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