www.ti.com

EXAMPLE STENCIL DESIGN

44X (0.5)

48X (1.6)

48X (0.3)

(R0.05) TYP

(8.5)

(8.5)

PowerPAD

HTQFP - 1.2 mm max height

PHP0048G

PLASTIC QUAD FLATPACK

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:8X

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

BASED ON

0.125 THICK STENCIL

SYMM

SYMM

48

37

13

24

25

36

1

12

METAL COVERED

BY SOLDER MASK

49

4.37 X 4.37

0.175

4.72 X 4.72

0.150

5.17 X 5.17 (SHOWN)

0.125

5.78 X 5.78

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

4225861/A

4/2020

(5.17)

(5.17)

BASED ON

0.125 THICK

STENCIL