A

A

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PACKAGE OUTLINE

C

20X

0.3

0.2

1.05

0.95

20X

0.45

0.35

1.0

0.8

(0.2) TYP

0.05

0.00

14X 0.5

2X

3.5

2X 0.5

3.05

2.95

(0.1) MIN

(0.13)

A

2.6

2.4

B

4.6

4.4

VQFN - 1 mm max height

RKS0020B

PLASTIC QUAD FLATPACK - NO LEAD

4226762/A 06/2021

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

20

11

10

8

9

19

18

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

1

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.300

SECTION A-A

TYPICAL

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SN74HCS573-Q1

SCLS852 – DECEMBER 2021

Copyright © 2021 Texas Instruments Incorporated

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