LTM4671 datasheet(29/36 Pages) AD

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LTM4671

Rev. B

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APPLICATIONS INFORMATION

SAFETY CONSIDERATIONS

The LTM4671 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and over current protection.

LAYOUT CHECKLIST/EXAMPLE

The high integration of LTM4671 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout con-

siderations are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND, VOUT1 and VOUT2. It helps to

minimizethePCBconductionlossandthermalstress.

• Place high frequency ceramic input and output

capacitors next to the VIN, PGND and VOUT pins to

minimize high frequency noise.

• Place a dedicated power ground layer underneath

the unit.

• Tominimizetheviaconductionlossandreducemodule

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put via directly on the pad, unless they are

capped or plated over.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

• For parallel modules, tie the VOUT,VFB,andCOMPpins

together. Use an internal layer to closely connect these

pins together. The TRACK pin can be tied a common

capacitor for regulator soft-start.

• Bring out test points on the signal pins for monitoring.

Figure29givesagoodexampleoftherecommendedlayout.

Figure 29. Recommended PCB Layout

4671 F29

GND

VIN

VOUT0

VOUT3

GND

VOUT2

VOUT1

LTM4671 Datasheet(PDF) 29 Page - Analog Devices

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