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LTC4089 Datasheet(PDF) 9 Page - Analog Devices |
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LTC4089 Datasheet(HTML) 9 Page - Analog Devices |
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9 / 26 page ![]() LTC4041 9 Rev A For more information www.analog.com PIN FUNCTIONS VSYS (Pins 1, 24): System Voltage Output Pin. This pin is used to provide power to an external load from either the primary input supply or from the backup supercapacitor if the primary input supply is not available. In addition to supplying power to the load, this pin provides power to charge the supercapacitor when input power is available. VSYS should be bypassed with a low ESR ceramic capaci- tor of at least 100μF to GND. PROG (Pin 2): Charge Current Program Pin. An external resistor from the PROG pin to GND programs the full- scale charge current. At full scale, the PROG pin servos to 0.8V. The ratio of the SCAP pin current to the PROG pin current is internally set to 2500. IMON (Pin 3): VSYS Current Monitoring Pin. The ratio between the IMON pin voltage and the differential voltage between VIN and CLN is internally set to 32. Charge cur- rent is reduced when the IMON pin voltage reaches 0.8V. CHGEN (Pin 4): Disable Pin for the Supercapacitor Charger. Tie this pin to GND to enable the charger or to a voltage above 1.2V to disable it. Do not leave this pin unconnected. BSTEN (Pin 5): Disable Pin for the Backup Boost Converter. Tie this pin to GND to enable the boost backup or to a volt- age above 1.2V to disable backup. Do not leave this pin unconnected. VIN (Pin 6): Input Pin. Power can be applied directly to this pin if the optional overvoltage protection (OVP) fea- ture is not used. For applications where the OVP feature is required, connect an external N-channel FET between the input supply VPWR and this pin. CLN (Pin 7): Negative terminal pin for an external cur- rent limit sense resistor connected between VIN and this pin. This resistor is used to monitor the current from VIN to VSYS. The LTC4041 reduces charge current in order to maintain 25mV across this sense resistor. However, it does not limit the system current if the drop exceeds 25mV. CAPFLT (Pin 8): Open-Drain Supercapacitor Fault Status Output. In charger mode, if the voltage of any single supercapacitor exceeds 2.7V, this pin is pulled low and charging is disabled. In backup mode, if the voltage of any single supercapacitor falls below –20mV, the CAPFLT pin is pulled low and the backup boost is disabled. To keep charging or backup enabled under any supercapacitor fault condition, tie this pin high. The current pull-down capability of the CAPFLT is 10µA. BAL (Pin 9): Supercapacitor Balance Point. Connect the common node of a stack of two supercapacitors to this pin. An internal supercapacitor balancer drives this node to a voltage that is half of VSCAP. Leave this pin open if only one supercapacitor is used. RSTFB (Pin 10): SYSGD Comparator Input. High imped- ance input to an accurate comparator with a 0.74V falling threshold and 20mV hysteresis. This pin controls the state of the SYSGD output pin. An external resistor divider is used between VSYS, RSTFB and GND. It can be the same resistor divider as the BSTFB divider to monitor the sys- tem output voltage VSYS. See the Applications Information section. SYSGD (Pin 11): Open-Drain Status Output of the SYSGD Comparator. This pin is pulled to GND by an internal N-channel MOSFET whenever the RSTFB pin falls below 0.74V. CAPFB (Pin 12): Supercapacitor (Single or a Stack of Two) Feedback Pin. An external divider between the SCAP pin and GND with the center tap connected to the CAPFB pin programs the final supercapacitor (or stack) voltage(VCHG). The voltage on this pin nominally servos to 0.8V. CAPGD (Pin 13): Supercapacitor Power Good Indicator Pin. The open-drain output is pulled low until CAPFB rises to 92.5% of its regulation point. PFO (Pin 14): Open-Drain Power-Fail Status Output. This pin is pulled to GND by an internal N-channel MOSFET when the PFI input is below the falling threshold of the power-fail comparator. Once the PFI input rises above the rising threshold, this pin becomes high impedance. |
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