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BC848CDW Datasheet(PDF) 2 Page - FutureWafer Tech Co.,Ltd |
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BC848CDW Datasheet(HTML) 2 Page - FutureWafer Tech Co.,Ltd |
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2 / 15 page ![]() BC846DW / BC847DW / BC848DW NPN Silicon Epitaxial General Purpose Transistors Document No.: F51833S 20-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 2/15 2. Contents 1. Synopsis.............................................................................................................................................. 1 1-1. Feature List ............................................................................................................................... 1 1-2. Mechanical Characteristics ..................................................................................................... 1 1-3. Device Characteristics............................................................................................................. 1 2. Contents .............................................................................................................................................. 2 3. Electrical Property............................................................................................................................. 3 3-1. Electrical Characteristics ......................................................................................................... 3 3-2. On Characteristics.................................................................................................................... 3 3-3. Small Signal Characteristics ................................................................................................... 3 3-4. Ratings and Characteristics Curve- Figure 1 - 6 .................................................................. 4 3-4. Ratings and Characteristics Curve- Figure 7 - 12................................................................ 5 3-4. Ratings and Characteristics Curve- Figure 13 - 18.............................................................. 6 3-4. Ratings and Characteristics Curve- Figure 19 - 24.............................................................. 7 3-4. Ratings and Characteristics Curve- Figure 25 - 30.............................................................. 8 3-4. Ratings and Characteristics Curve- Figure 31 - 36.............................................................. 9 3-4. Ratings and Characteristics Curve- Figure 37 - 39............................................................ 10 4. Soldering Parameters..................................................................................................................... 11 5. Package Information....................................................................................................................... 12 5-1. Dimension ............................................................................................................................... 12 5-2. PCB Pad Layout Recommendation ..................................................................................... 12 6. Packing .............................................................................................................................................. 13 6-1. Taping and Reel Specification.............................................................................................. 13 6-2. Embossed Carrier Tape Specification ................................................................................. 13 6-3. Surface Mount Reel Specification ........................................................................................ 14 6-4. Tape Leader and Trailer Specification................................................................................. 14 7. Ordering Information ...................................................................................................................... 15 8. Version............................................................................................................................................... 15 8-1. History...................................................................................................................................... 15 8-2. Company Profile..................................................................................................................... 15 |
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