CMD308

2-6 GHz Low Noise Amplifier

Data Sheet | August 19, 2021 | Subject to change without notice

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Mechanical Information

Die Outline (all dimensions in microns)

Notes:

1.

No connection required for unlabeled pads

2.

Backside is RF and DC ground

3.

Backside and bond pad metal: Gold

4.

Die is 100 microns thick

5.

DC bond pad (2) is 100 x 100 microns

6.

RF bond pads (1, 3) are 100 x 150 microns

1350.00

2062.00

634.50

1

2

3

88.0

2300.00

625.00

1262.00

2212.00