TLV9151 datasheet(7/54 Pages) TI

7 / 54 page

6.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TLV9152-Q1

Unit

(SOIC)

DGK

(VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

132.6

176.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

73.4

68.1

°C/W

RθJB

Junction-to-board thermal resistance

76.1

98.2

°C/W

ψJT

Junction-to-top characterization parameter

24.0

12.0

°C/W

ψJB

Junction-to-board characterization parameter

75.4

96.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TLV9154-Q1

UNIT

(SOIC)

DYY

(SOT-23)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

101.4

110.7

118.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57.6

55.9

47.6

°C/W

RθJB

Junction-to-board thermal resistance

57.3

35.3

60.9

°C/W

ψJT

Junction-to-top characterization parameter

18.5

2.3

6.0

°C/W

ψJB

Junction-to-board characterization parameter

56.9

35.1

60.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

TLV9151-Q1, TLV9152-Q1, TLV9154-Q1

SBOSA23D – MAY 2020 – REVISED SEPTEMBER 2021

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Product Folder Links: TLV9151-Q1 TLV9152-Q1 TLV9154-Q1

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