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IRFR310TRLPBFA Datasheet(PDF) 1 Page - Vishay Siliconix |
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IRFR310TRLPBFA Datasheet(HTML) 1 Page - Vishay Siliconix |
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1 / 13 page ![]() IRFR310, IRFU310, SiHFR310, SiHFU310 www.vishay.com Vishay Siliconix S21-0771-Rev. E, 19-Jul-2021 1 Document Number: 91272 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Power MOSFET FEATURES • Dynamic dV/dt rating • Repetitive avalanche rated • Surface-mount (IRFR310, SiHFR310) • Straight lead (IRFU310, SiHFU310) • Available in tape and reel • Fast switching • Fully avalanche rated • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION Third generation power MOSFETs form Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU, SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface-mount applications. Note a. See device orientation Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) b. VDD = 50 V, starting TJ = 25 °C, L = 52 mH, Rg = 25 Ω, IAS = 1.7 A (see fig. 12) c. ISD ≤ 1.7 A, dI/dt ≤ 40 A/μs, VDD ≤ VDS, TJ ≤ 150 °C d. 1.6 mm from case e. When mounted on 1” square PCB (FR-4 or G-10 material) PRODUCT SUMMARY VDS (V) 400 RDS(on) ( Ω)VGS = 10 V 3.6 Qg max. (nC) 12 Qgs (nC) 1.9 Qgd (nC) 6.5 Configuration Single N-Channel MOSFET G D S DPAK (TO-252) IPAK (TO-251) G D S S D G D Available ORDERING INFORMATION Package DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) IPAK (TO-251) Lead (Pb)-free and halogen-free SiHFR310-GE3 SiHFR310TRL-GE3 SiHFR310TR-GE3 SiHFU310-GE3 SiHFR310TRR-GE3 IRFR310TRPbF-BE3 IRFR310TRLPbF-BE3 - Lead (Pb)-free IRFR310PbF IRFR310TRLPbF a IRFR310TRPbF a IRFU310PbF ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-source voltage VDS 400 V Gate-source voltage VGS ± 20 Continuous drain current VGS at 10 V TC = 25 °C ID 1.7 A TC = 100 °C 1.1 Pulsed drain current a IDM 6.0 Linear derating factor 0.20 W/°C Linear derating factor (PCB mount) e 0.020 Single pulse avalanche energy b EAS 86 mJ Repetitive avalanche current a IAR 1.7 A Repetitive avalanche energy a EAR 2.5 mJ Maximum power dissipation TC = 25 °C PD 25 W Maximum power dissipation (PCB mount) e TA = 25 °C 2.5 Peak diode recovery dV/dt c dV/dt 4.0 V/ns Operating junction and storage temperature range TJ, Tstg -55 to +150 °C Soldering recommendations (peak temperature) d For 10 s 260 |
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