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LM9823CCWM Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LM9823CCWM Datasheet(HTML) 5 Page - National Semiconductor (TI) |
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5 / 22 page ![]() 5 www.national.com AC Electrical Characteristics The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz, except where noted otherwise. Boldface limits apply for TA=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7& 8) Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: All voltages are measured with respect to GND=AGND=DGND=0V, unless otherwise specified. Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN<GND or VIN>VA or VD), the current at that pin should be limited to 25mA. The 50mA max- imum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25mA to two. Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, ΘJA and the ambient temperature, TA. The maximum allow- able power dissipation at any temperature is PD = (TJmax - TA) / ΘJA. TJmax = 150°C for this device. The typical thermal resistance (ΘJA) of this part when board mounted is 69°C/W for the M28B SOIC package . Note 5: Human body model, 100pF capacitor discharged through a 1.5k Ω resistor. Machine model, 200 pF capacitor discharged through a 0Ω resistor. Note 6: See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any National Semiconductor Linear Data Book for other methods of soldering surface mount devices. Power Supply Characteristics IA Analog Supply Current Operating 75 108 mA (max) Power Down 675 900 µA (max) ID Digital Supply Current (Note 15) Operating 210 475 µA (max) Power Down 2 25 µA (max) Symbol Parameter Conditions Typical (Note 9) Limits (Note 10) Units (Limits) fMCLK Maximum MCLK frequency 12 MHz (min) tMCLK MCLK period 83 ns (min) MCLK duty cycle 40 60 %(min) %(max) tSCLK Serial Clock Period 1 tMCLK(min) tSEN Serial Enable high time 3 tMCLK(min) tSSU SDI setup time 1 ns (min) tSH SDI hold time 3 ns (min) tSDDO SCLK edge to new valid data VD = 5.0V VD = 3.3V 8.5 19 20 ns (max) tVSU VSMP setup time 1 ns (min) tVH VSMP hold time 3 ns (min) tCSU CLMP setup time 1 ns (min) tCH CLMP hold time 3 ns (min) tDDO MCLK edge to new valid data VD = 5.0V VD = 3.3V 16 25 25 ns (max) ns (max) DC and Logic Electrical Characteristics (Continued) The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz. Boldface limits apply for TA=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7 & 8) Symbol Parameter Conditions Typical (Note 9) Limits (Note 10) Units (Limits) |
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