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INA821 Datasheet(PDF) 25 Page - Texas Instruments |
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INA821 Datasheet(HTML) 25 Page - Texas Instruments |
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25 / 28 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 16X (0.6) 16X (0.25) 12X (0.5) (2.8) (2.8) ( 1.55) (R0.05) TYP VQFN - 1 mm max height RGT0016J PLASTIC QUAD FLATPACK - NO LEAD 4224573/B 11/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM ALL AROUND METAL BASED ON 0.1 mm THICK STENCIL SOLDER PASTE EXAMPLE THERMAL PAD 17: 87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X SYMM 1 4 5 8 9 12 13 16 17 www.ti.com INA851 SBOS999 – MARCH 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: INA851 |
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