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ADM7150ACPZ-4.5-R7 Datasheet(PDF) 6 Page - Analog Devices

Part # ADM7150ACPZ-4.5-R7
Description  800 mA Ultralow Noise, High PSRR, RF Linear Regulator
PDF  24 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADM7150ACPZ-4.5-R7 Datasheet(HTML) 6 Page - Analog Devices

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ADM7150
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
3
BYP
4
GND
1
VREG
2
VOUT
6 REF
5 REF_SENSE
8 VIN
7 EN
ADM7150
TOP VIEW
(Not to Scale)
NOTES
1. EXPOSED PAD ON THE BOTTOM OF THE PACKAGE.
EXPOSED PAD ENHANCES THERMAL PERFORMANCE AND IS
ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE.
CONNECT THE EXPOSED PAD TO THE GROUND PLANE ON
THE BOARD TO ENSURE PROPER OPERATION.
Figure 3. 8-Lead LFCSP Pin Configuration
ADM7150
TOP VIEW
(Not to Scale)
VREG
1
VOUT
2
BYP
3
GND
4
VIN
8
EN
7
REF
6
REF_SENSE
5
NOTES
1. EXPOSED PAD ON THE BOTTOM OF THE PACKAGE.
EXPOSED PAD ENHANCES THERMAL PERFORMANCE AND IS
ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE.
CONNECT THE EXPOSED PAD TO THE GROUND PLANE ON
THE BOARD TO ENSURE PROPER OPERATION.
Figure 4. 8-Lead SOIC Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
VREG
Regulated Input Supply to LDO Amplifier. Bypass VREG to GND with a 10 µF or greater capacitor. Do not connect
a load to ground.
2
VOUT
Regulated Output Voltage. Bypass VOUT to GND with a 10 µF or greater capacitor.
3
BYP
Low Noise Bypass Capacitor. Connect a 1 µF capacitor to GND to reduce noise. Do not connect a load to ground.
4
GND
Ground Connection.
5
REF_SENSE
REF_SENSE must be connected to the REF pin for proper operation. Do not connect to VOUT or GND.
6
REF
Low Noise Reference Voltage Output. Bypass REF to GND with a 1 µF capacitor. Short REF_SENSE to REF for fixed
output voltages. Do not connect a load to ground.
7
EN
Enable. Drive EN high to turn on the regulator and drive EN low to turn off the regulator. For automatic startup,
connect EN to VIN.
8
VIN
Regulator Input Supply. Bypass VIN to GND with a 10 µF or greater capacitor.
EPAD
Exposed Pad on the Bottom of the Package. The exposed pad enhances thermal performance and is electrically
connected to GND inside the package. Connect the exposed pad to the ground plane on the board to ensure
proper operation.
Rev. 0 | Page 6 of 24



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