ADP2503/ADP2504

Data Sheet

Rev. D | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN, VIN, SW1, SW2, VOUT, SYNC, EN, FB

−0.3 V to +6 V

PGND to AGND

−0.3 V to 0.3 V

Operating Ambient Temperature Range

−40°C to +125°C

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

ESD Human Body Model

±2000 V

ESD Charged Device Model

±1500 V

ESD Machine Model

±100 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

The ADP2503/ADP2504 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient tempera-

is within the specified temperature limits. In applications with

high power dissipation and poor thermal resistance, the maximum

ambient temperature may have to be derated. In applications

with moderate power dissipation and low PCB thermal resis-

tance, the maximum ambient temperature can exceed the

maximum limit as long as the junction temperature is within

4-layer board. The junction-to-ambient thermal resistance is

highly dependent on the application and board layout. In applica-

tions where high maximum power dissipation exists, close

may vary, depending on PCB material, layout, and environmental

4 inch × 3 inch circuit board. Refer to JEDEC JESD 51-9 for

detailed information on the board construction.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 3.

Package Type



JA

Unit

10-Lead LFCSP (QFN)

84

°C/W

ESD CAUTION