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MSK801 Datasheet(PDF) 3 Page - M.S. Kennedy Corporation |
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MSK801 Datasheet(HTML) 3 Page - M.S. Kennedy Corporation |
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3 / 6 page ![]() APPLICATION NOTES Heat Sinking To determine if a heat sink is necessary for your applica- tion and if so, what type, refer to the thermal model and governing equation below. Governing Equation: Example: This example demonstrates a worst case analysis for the op-amp output stage. This occurs when the output volt- age is 1/2 the power supply voltage. Under this condition, maximum power transfer occurs and the output is under maximum stress. Conditions: VCC=±16VDC VO=±8Vp Sine Wave, Freq.=1KHz RL=100 Ω For a worst case analysis we will treat the +8Vp sine wave as an 8VDC output voltage. 1.) Find Driver Power Dissapation PD=(VCC-VO) (VO/RL) = (16V-8V) (8V/100 Ω) = 0.64W 2.) For conservative design, set TJ=+125°C 3.) For this example, worst case TA=+50°C 4.) R θJC=65°C/W from MSK 801 Data Sheet 5.) R θCS=0.15°C/W for most thermal greases 6.) Rearrange governing equation to solve for R θSA Rev. C 8/05 3 TJ=PD x (R θJC + RθCS + RθJC) + TA Where TJ=Junction Temperature PD=Total Power Dissipation R θJC=Junction to Case Thermal Resistance R θCS=Case to Heat Sink Thermal Resistance R θSA=Heat Sink to Ambient Thermal Resistance TC=Case Temperature TA=Ambient Temperature TS=Sink Temperature Thermal Model: APPROXIMATE DESIRED GAIN RI(+) RI(-) Rf R1 C1 1 -1 500 Ω 1K Ω 1K Ω 43 Ω 0.01µf +1 1K Ω 0 Ω 0 Ω 43 Ω 0.01µf +5 0 Ω 910 Ω 3.6K Ω 120 Ω 0.01µf 1 910 Ω 1K Ω 10K Ω 150 Ω 0.01µf +10 -10 0 Ω 1K Ω 9.1K Ω 150 Ω 0.01µf Recommended External Component Selection Guide Using External Rf 1 -5 820 Ω 1K Ω 4.99K Ω 120Ω 0.01µf 1 The positive input resistor is selected to minimize offset currents. The positve input can be grounded without a resistor if desired. 2 This feedback capacitor will help compensate for stray input capacitance. The value of this capacitor can be dependent on individual applications. A 2 to 9 pf capacitor is usually optimum for most applications. Load Considerations When determining the load an amplifier will see, the capacative portion must be taken into consideration. For an amplifier that slews at 1000V/µS, each pf will require 1 mA of output current. To minimize ringing with highly capacitive loads, reduce the load time constant by adding shunt resistance. Case Connection The MSK 801 has pin 8 internally connected to the case. The case is not electrically connected to the internal circuit. Pin 8 should be tied to a ground plane for shielding. For special applications, consult factory. R θSA=((TJ-TA)/PD) - (RθJC) - (RθCS) = ((125°C -50°C)/0.64W) - 65°C/W - 0.15°C/W = 117.2 - 65.15 = 52.0°C/W Stability and Layout Considerations As with all wideband devices, proper decoupling of the power lines is extremely important. The power supplies should be bypassed as near to pins 10 and 12 as possible with a parallel grouping of a 0.01µf ceramic disc and a 4.7µf tantalum capacitor. Wideband devices are also sensitive to printed circuit board layout. Be sure to keep all runs as short as possible, especially those associated with the sum- ming junction, power lines and compensation pins. |
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