G2SB60 datasheet(4/62 Pages) VISHAY

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VISH AY GEN E RAL SE MIC O NDUCTORS

Diodes and Rectifiers

Application Note

SUPERECTIFIER® Design Brings New Level of

Reliability to Surface Mount Components

www.vishay.com

Revision: 15-Nov-16

Document Number: 88841

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

By Joseph M. Beck

Surface Mount technology is here to stay. After years of

plodding

through

cautious

experimentation,

many

manufacturers now have fully automated production lines in

place. These production lines place circuit components at

speeds that until recently would have been unthinkable.

Finally being realized are the benefits of what was once

considered

“Voo

Doo”

manufacturing

technology.

Component manufacturers have learned a great deal over

the past several years as well. Initially most surface mount

components were nothing more than retrofit, lead formed

versions

their

conventional

leaded,

through-hole

counterparts. For most manufacturers this was the quickest

and least costly method of “developing” a line of surface

mountable components.

It was soon discovered, however, that this approach to

component assembly would be unacceptable. Surface

mount technology placed new demands upon circuit

components. Electrically, the same power was being

required from smaller and smaller packages. Package

geometries and dimensions became critical in relation to

pick and place equipment and circuit board mounting. In

addition, the construction of these devices needed to be

such that they would suffer no ill effects when subjected to

the rigors of the new assembly environment that surface

mount

technology

presented.

Encountered

this

environment was extremely high-speed pick and place

equipment, component adhesive attachment, immersion in

molten solder and rapid temperature changes associated

with reflow soldering processes. All this meant that

component manufacturers would have to re-think their

approach to device fabrication. Yes, components needed to

be smaller; but they also needed to be more reliable.

At Vishay General Semiconductor, the development of new

surface mount components is not something that is taken

lightly. It is realized that in order to produce a truly reliable

surface mount product one must first consider all relevant

aspects of the technology. Only when this process has been

completed can a product be developed which is surface

mountable, and inherently reliable.

SURFACE MOUNT SUPERECTIFIER®

Vishay

General

Semiconductor

manufactures

surface

mount

rectifiers

the

popular

MELF

(metalized

electro-face) package style. These devices, denoted as

SUPERECTIFIERS, are available with a wide variety of electrical

characteristics. The main difference, however, between

these rectifiers and other MELF style devices lies in the area

device

construction.

Fig.

shows

the

unique

construction

employed

the

manufacture

the

Superectifier.

Fig. 1 - SUPERECTIFIER Construction

The construction of the Superectifier does not internally

utilize any soft solders. All interconnects are accomplished

by the use of a high temperature brazing process (600 °C).

Hence, any chances of solder void occurrence or internal

solder reflow during circuit board processing are eliminated.

In addition, the silicon rectifier junction is completely

encapsulated

cavity-free

glass.

This

glass

encapsulation

ensures

that

the

rectifier

junction

hermetically isolated from humidity and other harmful

environmental intrusions.

The resultant sub-assembly could be considered to be a

fully functional surface mount rectifier. In fact, many

component manufacturers offer MELF devices which have

this appearance; namely, an oblong glass bead with two

protruding metal end terminations. However, in order that

the

device

have

uniform

shape,

the

General

Semiconductor sub-assembly is over molded with epoxy.

The result is a smooth, perfectly cylindrical package.

TWO SIZES

Two different size Superectifier MELF packages are

available. Vishay General Semiconductor designation GL34

and GL41 are for 0.5 A and 1.0 A rectifier types, respectively.

JEDEC®

mechanical

specifications

DO-213AA

and

DO-213AB detail the dimensions of the GL34 and GL41,

respectively. Fig. 2 gives these package dimensions.

Completely encapsulated

brazed construction

Solderable

copper ends

UL recognized

flame retardant

molding compound

(UL 94 V-0)

Cavity-free

opague

glass-passivated

junction

Solderable

copper ends

Solid brazing, low resistance,

excellent surge capabilities

(brazed-temperature) 600 °C

G2SB60 Datasheet(PDF) 4 Page - Vishay Siliconix

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