7 Specifications

7.1 Absolute Maximum Ratings

MIN

MAX

UNIT

Input voltage

VIN1, VIN2 to AGND, PGND

–0.3

42

V

RBOOT to SW

–0.3

5.5

V

CBOOT to SW

–0.3

5.5

V

VLDOIN to AGND, PGND

–0.3

V

EN to AGND, PGND

–0.3

42

V

RT to AGND, PGND

–0.3

5.5

V

FB to AGND, PGND

–0.3

16

V

PG to AGND, PGND

0

20

V

PGND to AGND

–1

2

V

Output voltage

VCC to AGND, PGND

–0.3

5.5

V

SW to AGND, PGND(2)

–0.3

42

V

VOUT1, VOUT2 to AGND, PGND

–0.3

6

V

Input current

PG

10

mA

Junction temperature

–40

150

°C

Ambient temperature

–40

125

°C

Storage temperature

–55

150

°C

Peak reflow case temperature

250

°C

Maximum number of reflows allowed

3

Mechanical vibration

MIL-STD-883D, Method 2007.2, 20 Hz to 2 kHz

20

G

Mechanical shock

MIL-STD-883D, Method 2002.3, 1 ms, 1/2 sine, mounted

500

G

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

A voltage of 2 V below PGND and 2 V above VIN can appear on this pin for ≤ 200 ns with a duty cycle of ≤ 0.01%.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

www.ti.com

TLVM13640

SLVSGJ7 – APRIL 2022

Copyright © 2022 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: TLVM13640