| Electronic Components Datasheet Search |
|
BAS40L Datasheet(PDF) 1 Page - Vishay Siliconix |
|
|
|||||||||||||||||||||||||||||
BAS40L Datasheet(HTML) 1 Page - Vishay Siliconix |
|
1 / 5 page ![]() BAS40L www.vishay.com Vishay Semiconductors Rev. 1.3, 03-Dec-2021 1 Document Number: 86189 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Small Signal Schottky Diode LINKS TO ADDITIONAL RESOURCES MECHANICAL DATA Case: DFN1006-2A Weight: 0.83 mg Molding compound flammability rating: UL 94 V-0 Terminals: high temperature soldering guaranteed: Peak temperature max. 260 °C Packaging codes/options: 08/10K per 7" reel (8 mm tape) FEATURES • This diode features very low turn-on voltage and fast switching • This device is protected by a PN junction guard ring against excessive voltage, such as electrostatic discharges • Leadless ultra small DFN1006-2A package (1 mm × 0.6 mm × 0.45 mm) • Power dissipation better than SOT-23 • Surface-mounted device (SMD) plastic package with visible and sidewall plated / wettable flanks • Soldering can be checked by standard visual inspection. No X-ray inspection necessary to meet automotive AOI requirements • AEC-Q101 qualified available • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 2 1 333 DDD3 D 3D Models Models Application Notes Available PARTS TABLE PART ORDERING CODE AEC-Q101 QUALIFIED CIRCUIT CONFIGURATION TYPE MARKING REMARKS BAS40L BAS40L-G3-08 no Single A. Tape and reel BAS40L-HG3-08 yes ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage VR 40 V Forward current on FR-4 board with recommended soldering footprint IF 200 mA Non-repetitive peak forward current Tj = 25 °C, tp = 10 ms IFSM 500 mA Tj = 100 °C, tp = 10 ms 200 Tj = 125 °C, tp = 20 μs 500 Power dissipation on FR-4 board with recommended soldering footprint Ptot 300 mW RthJL = 100 K/W 1250 mW THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Thermal resistance junction to ambient air according to JEDEC® 51-3 on FR-4 board with recommended soldering footprint RthJA 420 K/W Thermal resistance junction to lead RthJL 100 K/W Maximum junction temperature Tj max. 150 °C Storage temperature range Tstg -55 to +150 °C Operating temperature range Top -55 to +150 °C |
Similar Part No. - BAS40L |
|
Similar Description - BAS40L |
|
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |