SOIC−20 WB

CASE 751D−05

ISSUE H

DATE 22 APR 2015

SCALE 1:1

20

1

11

10

b

20X

c

18X

A1

A

SEATING

PLANE

q

E

D

M

0.25

S

A

S

B

T

e

T

B

A

DIM

MIN

MAX

MILLIMETERS

A

2.35

2.65

A1

0.10

0.25

b

0.35

0.49

c

0.23

0.32

D

12.65

12.95

E

7.40

7.60

e

1.27 BSC

H

10.05

10.55

h

0.25

0.75

L

0.50

0.90

q

0

7

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF B

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

__

XXXXX = Specific Device Code

A

= Assembly Location

WL

= Wafer Lot

YY

= Year

WW

= Work Week

G

= Pb−Free Package

GENERIC

MARKING DIAGRAM*

20

1

XXXXXXXXXXX

XXXXXXXXXXX

AWLYYWWG

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

11.00

20X

0.52

20X

1.30

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

10

20

11

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98ASB42343B

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

SOIC−20 WB

© Semiconductor Components Industries, LLC, 2019

www.onsemi.com